Silverthread’s VP of Engineering, Sean Gilliland, demos CodeMRI® tools at TechDebt 2019

TechDebt 2019 has invited Sean Gilliland, VP of Engineering at Silverthread, to present at its conference in Montreal, Canada May 26-27, 2019. Sean Gilliland will demonstrate Silverthread’s CodeMRI®  Technical Health Assessment tools as part of the Tool Demo session.

Sean Gilliland’s Expertise in Technical Debt

Sean’s experience and expertise with technical debt stems from his academic and professional experience. As VP of Engineering at Silverthread, a software economics company, Sean Gilliland architects innovative solutions to assess and reduce technical debt. Sean leads the development and production of tools that quantify design quality, assess technical debt, and evaluate software economics. Sean recently led Silverthread’s engineering team in releasing the next generation of CodeMRI® Care, which not only provides developers with an actionable roadmap for paying down technical debt, but also enables them to proactively monitor technical health and design quality from inception.

Sean’s previous work as a software development manager and engineer with International Game Technology included traditional game and platform development, product design, international team leadership, and software architecture for multiple next-generation platforms. During this time, he was awarded three patents in intelligently adaptive game design. Sean earned a B.S. in computer science from the University of Nevada, Reno, and an M.S. in engineering and management from MIT.

Additional TechDebt 2019 highlights include:

• Keynote Addresses – TechDebt 2019 opens both days of the conference with keynotes delivered by power players in the technical debt community

• Research & Papers – Attendees at TechDebt 2019 can explore next generation academic and industry research on technical debt, quality, and innovative solutions

• Discussions – Leading researchers, experts and industry pioneers will discuss various topics from maintainability to improving technical debt metrics

TechDebt 2019 will be held May 26-27, 2019 at Fairmont The Queen Elizabeth Hotel located at 900 Rene Levesque Blvd. W H3B 4A5 Montreal, QC Canada. For more information, visit https://2019.techdebtconf.org/venue/icse-2019-venue.

About TechDebt 2019TechDebt 2019 is the second edition of the TechDebt Conference and will be held jointly with ICSE 2019 in Montreal, Canada May 26-27, 2019. The goal of the two-day conference is to bring together leading software researchers, practitioners, and tool vendors to explore theoretical and practical techniques that manage technical debt. The conference is sponsored by ACM SIGSOFT and IEEE TCSE. To learn more, visit https://2019.techdebtconf.org/home.